29 Oct 2024 NEPCON ASIA——Преглед на изложението
Детайли за събитието
NEPCON ASIA – As a widely influential electronic manufacturing professional exhibition, the 2024 NEPCON ASIA Asia Electronics Exhibition will be held from November 6th to 8th, 2024 at the Shenzhen International Convention and Exhibition Center (Bao’an).
This exhibition is expected to attract over 600 high-quality exhibitors from around the world, presenting innovative products and solutions in the three core areas of global circuit board assembly, semiconductor packaging and testing, automation, and smart factories. It aims to create a one-stop electronic manufacturing industry ecosystem, help domestic and foreign electronic production enterprises optimize their supply chains, achieve cost reduction and efficiency improvement, broaden their horizons, promote cooperation in the Asian electronic manufacturing industry chain, and accelerate the development of new quality productivity.
SMTFuture is waiting for you at the Yamaha 11 booth.
NEPCON ASIA, the Asian Electronic Production Equipment and Microelectronics Industry Exhibition, has:
- 60000+professional audience
- 600+exhibitors
- 60000 square meters exhibition hall area
Обхват на експонатите:
Повърхностен монтаж:
mounting technology and equipment, welding equipment, testing and measuring equipment, laboratory testing and measuring equipment, PCBA section testing and measuring equipment, finished product assembly section testing and measuring equipment, dispensing, spraying equipment, electronic materials&anti-static, electronic manufacturing services, other surface mounting technologies, hard boards, soft boards, soft hard bonding boards, circuit board chemicals, circuit board raw materials, circuit board special equipment, packaging equipment, PCB automation equipment, environmental protection treatment equipment.
Semiconductor packaging and testing:
semiconductor packaging and testing equipment, semiconductor materials, semiconductor packaging and testing factories, semiconductor design software, MINI LED production equipment and materials.
Automation and Intelligent Factory:
Industrial Robots, Finished Product Assembly Automation Integration, Automated Warehousing and Logistics, Transmission/Pneumatic Equipment&Accessories, Motion Control Equipment, Machine Vision and Sensing Technology, Industrial Automation Information Technology and Software, Other Automation Supporting Equipment/Accessories.
Exhibition highlights:
600+high-quality exhibitors gathered, and 150+new products were launched. Showcasing new products, technologies, solutions, and services related to surface mount technology, welding and spraying, testing and measurement, semiconductor packaging and testing, automation, and smart factories;
Over 40 professional forums and events. Organize a series of forums including the Electronic Manufacturing Forum, Semiconductor Packaging and Testing Forum, Intelligent Factory and Automation Technology Forum, New Energy Forum, ESG Forum, etc.
Build a demonstration zone for power semiconductor production. Newly launched IGBT&SiC production line+material display area, gathering 60+brands and their semiconductor packaging and testing equipment and materials, helping enterprises upgrade technology, optimize production lines, and achieve cost reduction and efficiency improvement.
Carry out international exchange activities. Promote in-depth exchanges and trade between domestic and international markets through visits to lighthouse factories, seminars on China’s electronic manufacturing and intelligent factory technology, and international specialized procurement and distribution meetings
NEPCON ∞ SPACE Automotive Electronic Disassembly Technology Sharing Area integrates core component display, salon, and experience to discuss the future of automotive electronics.
This exhibition is specially designed for professionals in the following fields:
Industry professionals from EMS, ODM, ODM, OBM, OSAT, agents/distributors/distributors, semiconductor design, wafer fab management, production management, quality inspection, procurement, supply chain management, and related functions.
Simultaneous activities:
Electronic Manufacturing Forum
- SMTA South China High Tech Technology Seminar (chargeable)
- SMTA South China High Tech Equipment Seminar.
- SMTA South China High Tech Technology Workshop (chargeable)
- 2024 (26th) Shenzhen Advanced Symposium on Intelligent Manufacturing and SMT Technology
Semiconductor Packaging and Testing Forum
- The First International Glass Through Hole Technology Innovation and Application Forum (ITGV 2024)
- The 7th ICPF Semiconductor Technology and Application Innovation Conference in 2024
- Forum 1: SiP and Advanced Semiconductor Packaging and Testing Technology
- The 7th ICPF Semiconductor Technology and Application Innovation Conference in 2024
- Forum 2: Power Semiconductor Technology and Applications
- Forum on Advanced Packaging Key Technologies and High Reliability Development
- Intelligent Factory and Automation Technology Forum
- AI Empowering Smart Factories: Leading the Future of Electronic Manufacturing
Automotive Electronics Forum
2024 Automotive Electrification Core Technology Forum
New Energy Forum
2024 New Energy Industry Technology and Application Forum
ESG Forum
SG Transformation of Consumer Electronics Manufacturing: The Road to Zero Carbon (Near Zero Carbon) Intelligent Lighthouse Factory Transformation
Events&Awards
- The 8th “Quick Cup” National Electronic Manufacturing Industry Welding Skills Competition – Guangdong Division
- The 2nd “Haicheng Cup” National Electronic Manufacturing Industry Wire Harness and Cable Production Process and Operation Skills Competition – Finals
- The 4th “Wangyou Cup” National Electronic Manufacturing Industry PCBA Design Competition – Finals
- ESAMBER Yibo Cup “National Electronic Manufacturing Industry Board level Fault Analysis and Maintenance Skills Competition
- The 18th Excellence Award Ceremony.
Съжаляваме, коментар форма е затворена в този момент.